POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE USING SAME
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United States of America Patent
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Issued Date -
Feb 4, 2016
app pub date -
Mar 25, 2014
filing date -
Apr 9, 2013
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Abandoned
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Abstract
The present invention provides a polyamide resin composition containing a polyamide resin (A) in which a diamine constituent unit thereof includes a constituent unit derived from a xylylenediamine (a-1), and a dicarboxylic acid constituent unit thereof includes a constituent unit derived from an α,ω-linear aliphatic dicarboxylic acid (a-2) having from 4 to 20 carbon atoms; and a polyether polyamide (B) in which a diamine constituent unit thereof includes constituent units derived from a polyether diamine compound (b-1) represented by a specified structural formula and a xylylenediamine (b-2), and a dicarboxylic acid constituent unit thereof includes a constituent unit derived from an α,ω-linear aliphatic dicarboxylic acid (b-3) having from 4 to 20 carbon atoms.
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