MOISTURE-CURABLE REACTIVE HOT-MELT ADHESIVE AGENT COMPOSITION
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United States of America Patent
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Oct 9, 2015
filing date -
Sep 9, 2010
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Abstract
The present invention aims to provide a moisture-curable reactive hot-melt adhesive composition which contains no vinyl chloride resin, which is excellent in adhesion to oily steel sheets and electroplated steel sheets, which has high strength immediately after application to effectively improve the production cycle, and which can be suitably used in vehicle applications. This challenge is solved by a moisture-curable reactive hot-melt adhesive that includes an oxyalkylene polymer containing a reactive silyl group, an alkyl (meth)acrylate (co)polymer, a tackifying resin, and a specific inorganic filler in combination.
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