SEMICONDUCTOR DEVICE HAVING HEAT DISSIPATION STRUCTURE AND LAMINATE OF SEMICONDUCTOR DEVICES
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United States of America Patent
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app pub date -
Oct 16, 2015
filing date -
May 23, 2013
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Abstract
A semiconductor device includes a semiconductor substrate, an electrode arranged on a first surface of the semiconductor substrate, a circuit formed on a second surface, of the semiconductor substrate, on an opposite side from the first surface, a conductor connecting the circuit and the electrode, a first lead arranged on an outer periphery of the semiconductor substrate, a connection member connecting the electrode and the first lead, and a sealing material sealing the semiconductor substrate, the first lead, and the connection member, where the second surface of the semiconductor substrate is exposed from the sealing material.
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