Methods of forming flip chip systems

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10236267
APP PUB NO 20160035686A1
SERIAL NO

14815086

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Abstract

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Forming the chip attachment system includes obtaining a chip having a bump core on a die. The method also includes obtaining an intermediate structure having a transfer pad on a substrate. The method further includes transferring the transfer pad from the substrate to the bump core such that the transfer pad becomes a solder layer on the bump core.

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Patent Owner(s)

  • KYOCERA INTERNATIONAL INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lieu, Dinah San Diego, US 1 0

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