PROCESS FOR PRODUCING THREE-DIMENSIONAL CONDUCTIVE PATTERN STRUCTURE, AND MATERIAL FOR THREE-DIMENSIONAL MOLDING FOR USE THEREIN
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United States of America Patent
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Issued Date -
Feb 4, 2016
app pub date -
Apr 10, 2014
filing date -
Apr 12, 2013
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Abstract
[Problem] To provide: a material which is for three-dimensional molding and on which a conductive pattern that exhibits excellent adhesiveness even after the three-dimensional molding can be formed; and a process for producing a three-dimensional conductive pattern structure, said process using this material for three-dimensional molding and necessitating no special apparatus. [Solution] This three-dimensional conductive pattern structure is produced by: using a material which is for three-dimensional molding and which has, in at least a part thereof, a surface made of a polyimide resin; conducting, in a surface portion (1) made of a polyimide resin, the formation of a modified pattern and then the adsorption and reduction of metal ions to form a material which is provided with a pattern (2) having a plating-catalyzing activity; and subjecting the material which is provided with the pattern (2) to three-dimensional molding and electroless plating successively.
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