Slurry for Selective Chemical Mechanical Polishing of Copper
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Feb 11, 2016
app pub date -
Aug 11, 2014
filing date -
Aug 11, 2014
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A slurry for selective chemical mechanical polishing of a copper layer is disclosed. The slurry includes either porous zeolite abrasive particles of substantially homogeneous composition having an average pore diameter of approximately 0.1-6 nanometers or hexagonal boron nitride abrasive particles. The slurry also includes an organic complexing compound that is 0.1-25 wt. % of the slurry, an oxidizer that is 0.1-10 wt. % of the slurry, and a solvent. A chemical mechanical polishing method for using the slurry is also disclosed.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully