PRINTED WIRING BOARD

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20160042861A1
SERIAL NO

14820666

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A printed wiring board includes a core substrate having a cavity, an inductor component positioned in the cavity of the substrate, a first buildup layer formed on first surface of the substrate, and a second buildup layer formed on second surface of the substrate. The inductor component includes an insulating layer having first openings and a second opening formed between the first openings, conductive through holes formed in the first openings, respectively, a magnetic body formed in the second opening, a first interconnect formed on first surface of the insulating layer and connecting the conductive through holes on the first surface of the insulating layer, and a second interconnect formed on second surface of the insulating layer and connecting the conductive through holes on the second surface of the insulating layer, and the first interconnect, second interconnect and conductive through holes are positioned to form a spiral structure.

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Patent Owner(s)

Patent OwnerAddress
IBIDEN CO LTD2-1 KANDA-CHO OGAKI-SHI GIFU 5038604 ?5038604

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KARIYA, Takashi Ogaki-shi, JP 120 2199
MANO, Yasuhiko Ogaki-shi, JP 35 505
MORITA, Haruhiko Ogaki-shi, JP 41 147
ONOGI, Toshihiko Ogaki-shi, JP 1 2
TANAKA, Yuki Ogaki-shi, JP 176 666
YOSHIKAWA, Kazuhiro Ogaki-shi, JP 116 1381

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