PRINTED WIRING BOARD

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20160042861A1
SERIAL NO

14820666

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A printed wiring board includes a core substrate having a cavity, an inductor component positioned in the cavity of the substrate, a first buildup layer formed on first surface of the substrate, and a second buildup layer formed on second surface of the substrate. The inductor component includes an insulating layer having first openings and a second opening formed between the first openings, conductive through holes formed in the first openings, respectively, a magnetic body formed in the second opening, a first interconnect formed on first surface of the insulating layer and connecting the conductive through holes on the first surface of the insulating layer, and a second interconnect formed on second surface of the insulating layer and connecting the conductive through holes on the second surface of the insulating layer, and the first interconnect, second interconnect and conductive through holes are positioned to form a spiral structure.

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Patent Owner(s)

Patent OwnerAddress
IBIDEN CO LTDOGAKI-SHI GIFU 503-8604

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KARIYA, Takashi Ogaki-shi, JP 120 2292
MANO, Yasuhiko Ogaki-shi, JP 35 545
MORITA, Haruhiko Ogaki-shi, JP 41 161
ONOGI, Toshihiko Ogaki-shi, JP 1 4
TANAKA, Yuki Ogaki-shi, JP 209 768
YOSHIKAWA, Kazuhiro Ogaki-shi, JP 118 1513

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