Semiconductor device and method of forming double-sided fan-out wafer level package
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United States of America Patent
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Oct 22, 2019
Grant Date -
Feb 11, 2016
app pub date -
Jul 31, 2015
filing date -
Aug 7, 2014
priority date (Note) -
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Abstract
A semiconductor device comprises a first semiconductor package including a conductive layer. A substrate including an interconnect structure is disposed over the conductive layer. The interconnect structure of the substrate with the conductive layer of the first semiconductor package are self-aligned. A plurality of openings is formed in the substrate. An adhesive is disposed between the substrate and the first semiconductor package and in the openings of the substrate. A redistribution layer (RDL) is formed over the first semiconductor package opposite the substrate. A pitch of the substrate is different from a pitch of the RDL. The adhesive extends to the interconnect structure of the substrate. A second semiconductor package is disposed over the substrate and the first semiconductor package.
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