SUBSTRATE STRUCTURE AND METHOD OF MANUIFACTURING THE SAME
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United States of America Patent
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N/A
Issued Date -
Feb 18, 2016
app pub date -
Nov 6, 2014
filing date -
Aug 12, 2014
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method of manufacturing a substrate structure is provided. An insulation substrate having an upper surface is provided. A portion of the upper surface of the insulation substrate is irradiated by a first laser beam so as to form a first intaglio pattern. The first laser beam is IR laser beam or fiber laser beam. The first intaglio pattern has a modification surface. A first metal layer is formed on the upper surface of the insulation substrate, and covers the upper surface of the insulation layer and the modification surface of the first intaglio pattern, and fills up the first intaglio pattern. A grinding process is performed on the first metal layer so as to expose the upper surface of the insulation substrate and define a first patterned circuit layer. A first upper surface of the first patterned circuit layer is aligned with the upper surface of the insulation substrate.
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