METHOD FOR REMOVING BRITTLE-HARD MATERIAL BY MEANS OF LASER RADIATION
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United States of America Patent
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app pub date -
Mar 21, 2014
filing date -
Mar 26, 2013
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Abstract
Laser radiation is used for removing brittle-hard material from a substrate without damaging the material. A removal depression having a flank angle w of the flanks of the removal depression forms in the material as a result of the removal. The removal depression forms with an entry edge, which is defined as a spatially expanded region of the surface of the material, where an unchanged and thus unremoved portion of the surface of the material transitions into the removal depression. Spatial portions of the laser radiation are refracted and focused into the volume of the unremoved material at this entry edge. The distribution of the laser radiation is set such that the entry edge assumes a small spatial expansion, such that the portion of the power of the laser radiation, which is captured by the focusing effect of the entry edge, is not sufficient to generate a threshold value ρdamage for the electron density in the volume of the material, thus avoiding damage to the material.
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