TOUCH PANELS AND METHODS
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United States of America Patent
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N/A
Issued Date -
Feb 25, 2016
app pub date -
Jul 23, 2015
filing date -
Aug 25, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A touch panel including a polymer substrate exhibiting a heat deflection temperature at which the polymer substrate becomes substantially deformable, a transparent conductive film disposed on the polymer substrate, the transparent conductive film including a body portion, a tail portion integrally formed with the body portion, and a plurality of conductive structures at least some of which are embedded within the body portion and tail portion, an electronic assembly compound disposed between the transparent conductive film and at least one electronic component, the electronic assembly compound exhibiting a curing temperature range that is less than 185° C., at least a portion of the curing temperature range being colder than the heat deflection temperature, where the at least one electronic component is bonded to the transparent conductive film by the electronic assembly compound.
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