ARRANGEMENT AND CONSTRUCTION FOR AIRFRAME WIRES
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United States of America Patent
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Issued Date -
Feb 25, 2016
app pub date -
Aug 19, 2014
filing date -
Aug 19, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An airframe wire is provided having a conductor and a first inner layer of polyimide insulation which is a helically applied tape including a polyimide component. A second outer layer of fluoropolymer insulation is a helically applied tape made from PTFE, where the second outer PTFE layer of fluoropolymer insulation is constructed as a substantially seamless outer layer so as to provide a hydrostatic barrier for the underlying inner first layer.
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