BALL GRID ARRAY PACKAGE WITH MORE SIGNAL ROUTING STRUCTURES
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United States of America Patent
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Issued Date -
Feb 25, 2016
app pub date -
Aug 19, 2014
filing date -
Aug 19, 2014
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A semiconductor package includes a substrate, a die mounted on a first side of the substrate, an array of solder balls mounted on a second, opposite side of the substrate, and a signal-routing structure mounted on the first side of the substrate and adjacent to the die. The substrate and the signal-routing structure provide electrical connections between die pads on the die and some of the solder balls.
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