STRUCTURE AND METHOD TO MINIMIZE WARPAGE OF PACKAGED SEMICONDUCTOR DEVICES
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Aug 29, 2014
filing date -
Aug 29, 2014
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A packaged semiconductor device includes a substrate, an electronic device coupled to the substrate, encapsulant including a first major surface surrounding the electronic device, and an oxygen barrier layer within fifty percent of a thickness of the encapsulant from a second major surface of the encapsulant. The oxygen barrier covers at least a portion of an area of the second major surface of the encapsulant to help reduce or eliminate warping of the encapsulant and/or the substrate of the packaged semiconductor device due to oxidation. A thickness of the oxygen barrier layer is less than 100 microns.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully