SEMICONDUCTOR DEVICE
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United States of America Patent
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Issued Date -
Mar 3, 2016
app pub date -
Apr 11, 2014
filing date -
Apr 17, 2013
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
One semiconductor device includes a wiring board, a semiconductor chip, and an encapsulation body. The wiring board includes an insulating base, a conductive pattern that is formed on one surface of the insulating base, and a heat dissipation via that is connected to the conductive pattern. The heat dissipation via is provided so as to penetrate through the insulating base from one surface to the other surface, while being exposed from the lateral side of the insulating base. The semiconductor chip is mounted on the wiring board so as to overlap the conductive pattern. The encapsulation body is formed on the wiring board so as to cover the semiconductor chip.
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