COUPLING OF AN INTERPOSER TO A PACKAGE SUBSTRATE

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United States of America Patent

APP PUB NO 20160064320A1
SERIAL NO

14470670

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Abstract

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An integrated circuit chip stack and a method for forming the same in which bond pads of an interposer are directly bonded to bond pads of a package substrate using only pre-solder. The interposer can have a bond pad pitch of less than 150 micrometers. The interposer can be an organic interposer. The pro-solder can be melted to make contact with the bond pads of the package substrate and the interposer. After solidifying, the pre-solder can form an electrical connection between a bond pad of the interposer and a bond pad of the package substrate.

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Patent Owner(s)

Patent OwnerAddress
CISCO TECHNOLOGY INC170 WEST TASMAN DRIVE SAN JOSE CA 95134-1706

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Li, Li San Ramon, US 957 9145
Nagar, Mohan R Cupertino, US 15 43
Savic, Jovica Downer's Grove, US 29 217

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