COUPLING OF AN INTERPOSER TO A PACKAGE SUBSTRATE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20160064320A1
SERIAL NO

14470670

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An integrated circuit chip stack and a method for forming the same in which bond pads of an interposer are directly bonded to bond pads of a package substrate using only pre-solder. The interposer can have a bond pad pitch of less than 150 micrometers. The interposer can be an organic interposer. The pro-solder can be melted to make contact with the bond pads of the package substrate and the interposer. After solidifying, the pre-solder can form an electrical connection between a bond pad of the interposer and a bond pad of the package substrate.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
CISCO TECHNOLOGY, INC.SAN JOSE, CA14366

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Li, Li San Ramon, US 851 7849
Nagar, Mohan R Cupertino, US 15 37
Savic, Jovica Downer's Grove, US 28 195

Cited Art Landscape

Patent Info (Count) # Cites Year
 
ORACLE INTERNATIONAL CORPORATION (1)
* 2014/0321,803 HYBRID-INTEGRATED PHOTONIC CHIP PACKAGE WITH AN INTERPOSER 1 2013
 
SENJU METAL INDUSTRY CO., LTD. (1)
* 2015/0333,027 Method of Forming Solder Bump, and Solder Bump 0 2015
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
MICRON TECHNOLOGY, INC. (1)
* 9640458 Stacked microelectronic devices 0 2014
* Cited By Examiner