PART-EMBEDDED CIRCUIT STRUCTURE AND METHOD FOR MANUFACTURING SAME
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United States of America Patent
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Issued Date -
Mar 3, 2016
app pub date -
Sep 1, 2015
filing date -
Sep 2, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method for manufacturing a part-embedded circuit structure includes: forming an inner resist layer with an opening on a base member to expose a portion of the base member; forming an inner wiring layer on the inner resist layer which extends into the opening of the inner resist layer; laminating a dielectric layer on the inner wiring layer; forming an outer wiring layer on the dielectric layer opposite to the inner wiring layer; and removing the base member to expose the inner wiring layer in the opening and the inner resist layer such that a level plane is formed.
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