COOLING ARRANGEMENT FOR A CIRCUIT PACK

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20160066469A1
SERIAL NO

14472684

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A circuit structure comprises a circuit board. An array of opto-electronic devices is provided on the circuit board. At least some of heat sinks are provided in thermal contact with a respective opto-electronic device. A face plate of the circuit structure comprises an array of openings configured to allow air to move along a path adjacent to an opto-electronic device and through a respective heat sink. An air moving device is located adjacent a heat sink and is operable to drive air through a respective opening on the face plate. A ducting structure is provided to direct the air driven by a corresponding air moving device.

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Patent Owner(s)

Patent OwnerAddress
ALCATEL-LUCENT USA INC600-700 MOUNTAIN AVENUE MURRAY HILL NJ 07974

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Salamon, Todd Richard New Providence, US 16 90
Yoh, Chaonong Matawan, US 12 119

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