COOLING ARRANGEMENT FOR A CIRCUIT PACK

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20160066469A1
SERIAL NO

14472684

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A circuit structure comprises a circuit board. An array of opto-electronic devices is provided on the circuit board. At least some of heat sinks are provided in thermal contact with a respective opto-electronic device. A face plate of the circuit structure comprises an array of openings configured to allow air to move along a path adjacent to an opto-electronic device and through a respective heat sink. An air moving device is located adjacent a heat sink and is operable to drive air through a respective opening on the face plate. A ducting structure is provided to direct the air driven by a corresponding air moving device.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
ALCATEL-LUCENT USA INC.MURRAY HILL, NJ1791

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Salamon, Todd Richard New Providence, US 16 70
Yoh, Chaonong Matawan, US 12 113

Cited Art Landscape

Patent Info (Count) # Cites Year
 
YAMAICHI ELICTRONICS CO., LTD. (1)
* 2014/0302,713 ELECTRICAL CONNECTOR MODULE 2 2013
 
MOLEX INCORPORATED (1)
* 2015/0342,085 Heat Dissipative Air Guide 0 2014
* Cited By Examiner

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