SEMICONDUCTOR CAVITY PACKAGE USING PHOTOSENSITIVE RESIN
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United States of America Patent
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Issued Date -
Mar 10, 2016
app pub date -
Sep 9, 2014
filing date -
Sep 9, 2014
priority date (Note) -
Abandoned
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Abstract
A packaged device (100) with a semiconductor chip (101) with a MEMS device (102) in the central chip area, wherein the package includes a light-sensitive first (150) and an opaque second (160) polymerized compound. The second compound (160) encapsulates the chip peripheral areas with the terminals (103) and wire bonds (130), and forms a sidewall (160a, diameter 112) around the un-encapsulated central area. The first compound (150) continues from the sidewall inward as a frame (inner diameter 110) around the un-encapsulated central area.
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