SEMICONDUCTOR SENSOR DEVICE FORMED WITH GEL SHEET
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United States of America Patent
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Issued Date -
Mar 10, 2016
app pub date -
Sep 5, 2014
filing date -
Sep 5, 2014
priority date (Note) -
Abandoned
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Abstract
A method for assembling a pressure sensor device uses a pressure-sensitive gel material that is applied to an active region of a pressure-sensing integrated circuit (IC) die. A molding compound is dispensed over the pressure-sensitive gel material to encapsulate the gel material. A portion of the molding compound is then removed to expose the gel material to an ambient environment outside of the packaged semiconductor device.
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