TOP COUPLED PHOTONIC CHIP ALIGNMENT PACKAGE

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United States of America Patent

APP PUB NO 20160070068A1
SERIAL NO

14845700

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Abstract

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The present invention provides an improved coupling and improved alignment of top-coupled photonic chips. The present invention includes a method to package and align top-coupling photonic chips using a holographic grating coupler and V-groove placement comprising the steps of: preparing the photonic chip with grating couplers, preparing the fibers by polishing the ends, preparing the cap chip by defining V-grooves to complement the photonic chip, attaching the fibers to the V-block cap chip, and top-cladding the cap chip to the photonic chip. The present invention also includes the apparatus resulting from the aforementioned method.

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Patent OwnerAddress
BAE SYS INF & ELECT SYS INTEGNot Provided

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Pomerene, Andrew TS Leesburg, US 21 60

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