TOP COUPLED PHOTONIC CHIP ALIGNMENT PACKAGE
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United States of America Patent
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Issued Date -
Mar 10, 2016
app pub date -
Sep 4, 2015
filing date -
Sep 8, 2014
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Abstract
The present invention provides an improved coupling and improved alignment of top-coupled photonic chips. The present invention includes a method to package and align top-coupling photonic chips using a holographic grating coupler and V-groove placement comprising the steps of: preparing the photonic chip with grating couplers, preparing the fibers by polishing the ends, preparing the cap chip by defining V-grooves to complement the photonic chip, attaching the fibers to the V-block cap chip, and top-cladding the cap chip to the photonic chip. The present invention also includes the apparatus resulting from the aforementioned method.
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