WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Mar 10, 2016
app pub date -
Sep 8, 2015
filing date -
Sep 8, 2014
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A wiring board with a built-in electronic component includes a substrate having a cavity, an electronic component accommodated in the cavity and having electrode terminals, an insulating layer formed on the substrate such that the insulating layer is covering the electronic component in the cavity, and via conductors formed through the insulating layer and including first via conductors and second via conductors such that the second via conductors are connected to the electrode terminals of the electronic component, respectively. The via conductors are formed in via formation holes penetrating through the insulating layer, respectively, and the via formation holes include first via formation holes and second via formation holes such that the second via formation holes are exposing the electrode terminals of the electronic component, respectively, and that a second via formation hole has a diameter which is smaller than a diameter of a first via formation hole.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully