HEAT DISSIPATION STRUCTURE OF HANDHELD DEVICE
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United States of America Patent
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Issued Date -
Mar 10, 2016
app pub date -
Sep 5, 2014
filing date -
Sep 5, 2014
priority date (Note) -
Abandoned
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Abstract
A heat dissipation structure of handheld device includes a carrier body. The carrier body has a first receiving space. The first receiving space has a heat absorption section and a heat dissipation section. The heat dissipation section is adjacent to the heat absorption section and formed with a heat dissipation layer. The heat absorption section is able to quickly absorb the heat generated by the electronic components carried by the carrier body and transfer the heat to the heat dissipation layer of the heat dissipation section so as to quickly dissipate the heat.
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