THERMOSETTING RESIN COMPOSITION AND METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE
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United States of America Patent
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Issued Date -
Mar 17, 2016
app pub date -
Apr 11, 2014
filing date -
Apr 19, 2013
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Abandoned
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Abstract
Provided are a thermosetting resin composition with which a semiconductor device having a high connection reliability can be provided while securing availability of member materials by reducing a difference in thermal-responsive behavior between a semiconductor element and an adherend, and a method for producing a semiconductor device using the thermosetting resin composition. The present invention provides a thermosetting resin composition for producing a semiconductor device, the thermosetting resin composition comprising: an epoxy resin; and a novolak-type phenol resin having a hydroxyl equivalent of 200 g/eq or more.
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