HEAT DISSIPATION STRUCTURE FOR MOBILE DEVICE
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United States of America Patent
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Issued Date -
Mar 17, 2016
app pub date -
Sep 11, 2014
filing date -
Sep 11, 2014
priority date (Note) -
Abandoned
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Abstract
A heat dissipation structure for mobile device includes an element holding member internally defining a first receiving space, in which a plurality of electronic elements of a mobile device is mounted; and a heat dissipation layer formed on at least one side of each of the electronic elements. The heat dissipation layer is formed on one side of each of the electronic elements through a micro arc oxidation (MAO) process, a plasma electrolytic oxidation (PEO) process, an anodic spark deposition (ASD) process, or an anodic oxidation by spark deposition (ANOF) process. Therefore, heat produced by the electronic elements in the mobile device can be quickly removed away from the electronic elements via the heat dissipation layer.
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