ZN BASED LEAD-FREE SOLDER AND SEMICONDUCTOR POWER MODULE
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United States of America Patent
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Issued Date -
Mar 24, 2016
app pub date -
Dec 13, 2013
filing date -
Jun 20, 2013
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Abandoned
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Abstract
Zn based lead-free solder is obtained in which its range of practical melting points is between 300° C. and 350° C. The Zn based lead-free solder includes a Cr content of 0.05 through 0.2 wt %, an Al content of 0.25 through 1.0 wt %, an Sb content of 0.5 through 2.0 wt %, a Ge content of 1.0 through 5.8 wt %, and a Ga content of 5 through 10 wt %; or the Zn based lead-free solder includes a Cr content of 0.05 through 0.2 wt %, an Al content of 0.25 through 1.0 wt %, an Sb content of 0.5 through 2.0 wt %, a Ge content of 1.0 through 5.8 wt %, and an In content of 10 through 20 wt %.
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