Mold for Manufacturing LED Mounting Substrate

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United States of America Patent

SERIAL NO

14956490

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Abstract

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A mold for manufacturing an LED mounting substrate includes a first molding die and a second molding die, The second molding die covers the first molding die. The second molding die includes a material holding tank, a pressing part and a material inlet channel. The pressing part is protruded on the material holding tank. The pressing part expands along a direction from the first molding die to the second molding die. The material inlet channel is connected between an outer wall of the second molding die and the material holding tank. The material inlet channel shrinks along a direction from the first molding die to the second molding die.

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Patent Owner(s)

Patent OwnerAddress
LEXTAR ELECTRONICS CORPORATION6F NO 21 LIXING RD HSINCHU SCIENCE PARK HSINCHU 300094

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Shing-Kuo Taipei City, TW 7 51
Ko, Bo-Yu New Taipei City, TW 26 244
Lin, Hsiu-Hsiang Hsinchu County, TW 4 3

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