A METHOD OF PREPARING A CONDUCTIVE METALLIC LAYER OR PATTERN
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United States of America Patent
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Mar 24, 2016
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Jul 2, 2014
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Jul 4, 2013
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Abstract
A method of preparing a conductive metallic layer or pattern includes the steps of applying a metallic nanoparticle dispersion on a support to obtain a metallic layer or pattern, and contacting the metallic layer or pattern with a solution containing an acid or an acid precursor capable of releasing the acid during curing of the metallic layer or pattern. It has been observed that by contacting the metallic layer or pattern with a solution containing an acid or an acid precursor capable of releasing the acid, higher conductivities at moderate curing conditions are obtained.
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