PACKAGE SUBSTRATE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Mar 24, 2016
app pub date -
Sep 22, 2015
filing date -
Sep 22, 2014
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A package substrate includes resin insulating interlayers, and four or more conductive layers including dedicated wiring layers such that the dedicated wiring layers are two dedicated wiring layers which transmit data between a first electronic component and a second electronic component connected by the two dedicated wiring layers.
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Family
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Cited Art Landscape
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