SIGNALING LINK GROUNDING
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United States of America Patent
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Issued Date -
Mar 24, 2016
app pub date -
Sep 22, 2014
filing date -
Sep 22, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Techniques for signal grounding are described herein. The techniques include a conductive element conductively coupled to an exposed ground pad of a circuit board. The conductive element is to conductively couple to a shield of a signaling link, and thereby conductively coupling the shield to the exposed ground pad.
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