GAS COOLING DEVICE AND REFLOW OVEN USING THEREOF
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United States of America Patent
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N/A
Issued Date -
Mar 31, 2016
app pub date -
Sep 25, 2015
filing date -
Sep 30, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention discloses a gas cooling device and a reflow oven using thereof. The gas cooling device comprises a liquid cooling machine, a plurality condensers and a plurality of outer sleeves. The condensers are disposed in parallel and connected to the liquid cooling machine, in which two ends of all the condensers are separately connected with valves. The outer sleeves are sleeved out of the condensers and communicatively connected in order, in which the outer sleeves disposed at two ends are provided, respectively, with a gas inlet and a gas outlet and each of the condensers is provided with a water outlet. Each of the condensers is formed a circulation with the cooling device. Even though any of the condensers is detached, other condensers are able to continue operating as long as the valves disposed at the two ends of the detached condenser are closed.

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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
PEGATRON CORPORATION | TAIPEI CITY 112 | |
MAINTEK COMPUTER (SUZHOU) CO LTD | SUZHOU CITY JIANGSU PROVINCE JINFENG ROAD 215011 NO 233 SUZHOU CITY JIANGSU PROVINCE 215011 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
CHUNG, JUNG-KUEI | Suzhou, CN | 3 | 5 |
XU, De-Qaing | Suzhou, CN | 1 | 0 |
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11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Sep 30, 2027 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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