HEAT DISSIPATION STRUCTURE FOR HAND-HELD DEVICE
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United States of America Patent
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Issued Date -
Mar 31, 2016
app pub date -
Sep 26, 2014
filing date -
Sep 26, 2014
priority date (Note) -
Abandoned
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Abstract
A heat dissipation structure for hand-held device includes an element holding member internally defining a receiving space, a base plate held in the receiving space and having a plurality of electronic elements mounted on a top thereof, at least one heat conductive layer provided on one side of the electronic elements opposite to the base plate, and a graphite layer provided on one side of the heat conductive layer opposite to the electronic elements. The heat conductive layer transfers heat produced by the electronic elements to the graphite layer, from where the heat is quickly dissipated into ambient air, enabling upgraded heat dissipation efficiency of the electronic elements.
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