SYSTEMS AND METHODS OF TREATING A SUBSTRATE
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United States of America Patent
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app pub date -
Sep 23, 2015
filing date -
Sep 30, 2014
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Abstract
Substrate treating systems are disclosed. The system may include a chamber with a processing space, a supporting unit provided in the processing space to support a substrate, a gas supplying unit provided in the processing space to supply gas into the processing space, a plasma source unit generating plasma from the gas, and a liner unit disposed to enclose the supporting unit. The supporting unit may include a supporting plate supporting a substrate. The liner unit may include an inner liner enclosing the supporting plate and an actuator vertically moving the inner liner.
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