NON-INSULATED POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20160093562A1
SERIAL NO

14857264

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Abstract

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A non-insulated power semiconductor module may include a housing, at least a pair of lead frames fixedly seated in the housing and having a plurality of power semiconductor chips mounted on surfaces thereof, and an insulation member disposed between the housing and the pair of lead frames.

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Patent Owner(s)

Patent OwnerAddress
HYUNDAI MOBIS CO LTD203 TEHERAN-RO GANGNAM-GU SEOUL 06141

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KIM, Jae-Bum Suwon-si, KR 25 103

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