BGA ballout partition techniques for simplified layout in motherboard with multiple power supply rail

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United States of America Patent

PATENT NO 9343398
APP PUB NO 20160093563A1
SERIAL NO

14497825

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Abstract

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A microelectronic package can include a substrate and a microelectronic element. The substrate can include terminals comprising at least first power terminals and other terminals in an area array at a surface of the substrate. The substrate can also include a power plane element electrically coupled to the first power terminals. The area array can have a peripheral edge and a continuous gap between the terminals extending inwardly from the peripheral edge in a direction parallel to the surface. The terminals on opposite sides of the gap can be spaced from one another by at least 1.5 times a minimum pitch of the terminals. The power plane element can extend within the gap from at least the peripheral edge at least to the first power terminals. Each first power terminal can be separated from the peripheral edge by two or more of the other terminals.

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Patent Owner(s)

  • INVENSAS CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bang, Kyong-Mo Fremont, US 25 589
Chen, Yong Palo Alto, US 426 3487
Sun, Zhuowen Campbell, US 49 326

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