HEAT DISSIPATION MODULE
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United States of America Patent
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Issued Date -
Mar 31, 2016
app pub date -
Mar 27, 2015
filing date -
Sep 30, 2014
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Abstract
A heat dissipation module includes a hollow housing, a plurality of heat dissipation fins and heat dissipation liquid. The hollow housing includes a chamber, a side surface, a top surface and a bottom surface opposite to the top surface. The side surface is connected to the top surface and the bottom surface. The heat dissipation fins are disposed on the side surface. The heat dissipation liquid is contained within the chamber, and a specific heat of the heat dissipation liquid is substantially greater than or equal to 1 cal/g° C.
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