Systems and methods for drying high aspect ratio structures without collapse using sacrificial bracing material that is removed using hydrogen-rich plasma
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United States of America Patent
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Sep 4, 2018
Grant Date -
Apr 7, 2016
app pub date -
Oct 6, 2014
filing date -
Oct 6, 2014
priority date (Note) -
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Abstract
Systems and methods for drying a substrate including a plurality of high aspect ratio (HAR) structures are performed after at least one of wet etching and/or wet cleaning the substrate using at least one of wet etching solution and/or wet cleaning solution, respectively, and without drying the substrate. Fluid between the plurality of HAR structures is displaced using a solvent including a bracing material. After the solvent evaporates, the bracing material precipitates out of solution and at least partially fills the plurality of HAR structures. The substrate is exposed to plasma generated using a plasma gas chemistry that is hydrogen rich to remove the bracing material thereby drying the substrate including the HAR structures without damaging the plurality of HAR structures.
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