PRINTED WIRING BOARD WITH METAL POST AND METHOD FOR MANUFACTURING THE SAME
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United States of America Patent
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app pub date -
Oct 5, 2015
filing date -
Oct 3, 2014
priority date (Note) -
Abandoned
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Abstract
A printed wiring board includes a resin insulating layer, a conductor layer formed on the resin insulating layer and including conductor pads, a solder resist layer formed on the resin insulating layer such that the solder resist layer is covering the conductor layer and has opening portions exposing the conductor pads, respectively, and metal posts formed on the conductor pads such that each of the metal posts is protruding from the solder resist layer and has a side surface forming an angle with respect to a surface of the solder resist layer.
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