PRINTED WIRING BOARD WITH BUMP AND METHOD FOR MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Apr 7, 2016
app pub date -
Oct 5, 2015
filing date -
Oct 3, 2014
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A printed wiring board includes a base insulating layer including an insulating material, a conductor layer formed on the base insulating layer and including conductor pads, a coating insulating layer formed on the base insulating layer such that the coating insulating layer is covering the conductor layer and having opening portions exposing the conductor pads, respectively, and bumps formed on the conductor pads respectively such that each of the bumps includes an electroless plating metal layer formed on a respective one of the conductor pads and a solder layer formed on the electroless plating metal layer, the electroless plating metal layer having an upper end surface formed such that a central portion of the upper end surface is recessed relative to a peripheral portion of the upper end surface.
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