PACKAGING STRUCTURE, MANUFACTURING METHOD THEREOF, AND DISPLAY PANEL
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United States of America Patent
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N/A
Issued Date -
Apr 14, 2016
app pub date -
Oct 9, 2015
filing date -
Oct 13, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present disclosure discloses a packaging structure and a manufacturing method thereof, and a display panel. The packaging structure includes: a sintering part, formed between the substrate and the cover plate, wherein an encapsulation space is formed by the sintering part, the cover plate and the substrate, and the light emitting display unit is formed in the encapsulation space; and a protection part, formed on the cover plate, wherein the sintering part partially contacts with the protection part and partially contact with the cover plate. The present disclosure provides a protection part between the sintering part and the cover plate, the sintering part is divided into non-sintering regions and sintering regions by the protection part which covers a part of regions of the sintering part, thus reducing high temperature and stress generated in the process of laser sintering.
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