LOW PROFILE HEAT SINK
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United States of America Patent
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Issued Date -
Apr 14, 2016
app pub date -
Oct 13, 2015
filing date -
Oct 13, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
A heat sink for an electronic component includes a base having a width. The base has a greater thickness at a middle portion along the width than at opposite end portions along the width. A plurality of elongate fins project from an upper surface of the base and extend in directions perpendicular to the upper surface.
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