Automatic height compensating and co-planar leveling heat removal assembly for multi-chip packages

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9743558
APP PUB NO 20160106003A1
SERIAL NO

14861892

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

Embodiments of the present disclosure may include a heat removal assembly that is to thermally couple with two or more dice of an electronic device. The heat removal assembly may include a bellows to automatically adjust a position of at least one surface of the heat removal assembly relative to another surface of the heat removal assembly. Other embodiments may be described and/or claimed.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • INTEL CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bosak, Henry C Hillsboro, US 5 18
Boyd, Thomas A North Plains, US 36 656
Kofstad, Harvey R Vernonia, US 7 139

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Feb 22, 2025
11.5 Year Payment $7400.00 $3700.00 $1850.00 Feb 22, 2029
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00