Electronic module and the fabrication method thereof
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United States of America Patent
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Issued Date -
Apr 21, 2016
app pub date -
Oct 15, 2015
filing date -
Oct 16, 2014
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Abstract
An electronic module is disclosed. The electronic module includes a substrate, a plurality of electronic components electrically connected to a first side of the substrate, and another plurality of electronic components embedded in the substrate. In some other embodiments, the electronic module further comprises a heat sink disposed on at least one of the plurality of electronic components to dissipate the heat generated by the at least one of the plurality of electronic components. And, in some other embodiment, the electronic module further comprises a molding disposed on the plurality of electronic components and, in further embodiments, the heat sink.
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