Base polymer for hot-melt adhesive agent, and hot-melt adhesive agent

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United States of America Patent

PATENT NO 9725626
APP PUB NO 20160115360A1
SERIAL NO

14894152

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Abstract

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Provided is a hot-melt adhesive which satisfies both solidification rate and adhesiveness. A base polymer for a hot-melt adhesive which satisfies the following (1) and (2): (1) a modulus of elasticity in tension at 23° C. is 400 MPa or less; and (2) a semi-crystallization time at 23° C. is 20 minutes or less.

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Patent Owner(s)

  • IDEMITSU KOSAN CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hashima, Kazuhiro Chiba, JP 5 14
Inoue, Masao Sodegaura, JP 96 954
Kobayashi, Kenji Chiba, JP 504 9120
Minami, Yutaka Chiba, JP 83 591
Takebe, Tomoaki Chiba, JP 44 211

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