Photocurable and thermocurable resin composition and dry film solder resist
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United States of America Patent
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Oct 3, 2017
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app pub date -
Oct 28, 2015
filing date -
Oct 28, 2014
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Abstract
Provided are a photocurable and thermocurable resin composition including: an acid-modified oligomer including an iminocarbonate-based compound containing a carboxyl group and a photocurable unsaturated functional group; a photopolymerizable monomer having two or more photocurable unsaturated functional groups; a thermocurable binder having a thermally curable functional group; a functional filler including one or more selected from the group consisting of carbon allotrope particles having a ceramic compound bound to a surface thereof and heat radiating ceramic particles; and a photoinitiator, and a dry film solder resist manufactured therefrom.
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