Plasma Processing Apparatus and Opening and Closing Mechanism used therein

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20160118225A1
SERIAL NO

14894922

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A plasma etching apparatus 1 includes a processing chamber 2 having a plasma generating portion 3, a processing portion 4, an exhaust portion 5, and a manifold portion 6 defined inside, and an exhaust mechanism 30 for exhausting gas in the processing chamber 2, the exhaust mechanism 30 is composed of a vacuum pump 31 having an intake port connected to an opening 8, a valve body 32 inserted through an opening 9, and a moving mechanism 34 for moving the valve body 32 in upward and downward directions, and the intake port of the vacuum pump 31 is connected to the opening 8 which is formed in a third chamber 2c forming a part of the processing chamber 2.

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Patent Owner(s)

Patent OwnerAddress
SPP TECHNOLOGIES CO LTDTOKYO 100-0003

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hayami, Toshihiro Hyogo, JP 38 1443

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