SEMICONDUCTOR DEVICE

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United States of America Patent

APP PUB NO 20160118343A1
SERIAL NO

14872275

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Low-voltage side wirings LWA and LWB extend in X-direction, respectively, while meandering along a main surface of a semiconductor substrate SUB. A high-voltage side wiring HAW is opposed to the meandering low-voltage side wiring LWA, and a high-voltage side wiring HWB is opposed to the meandering low-voltage side wirings LWB. The high-voltage side wirings HWA and HWB include: X-direction extending parts XA and XB extending in X-direction; and a plurality of Y-direction extending parts YA and YB extending, respectively, in Y-direction. Toward a section of the low-voltage side wiring LWA being away from the X-direction extending part XA, the Y-direction extending part YA has entered. Also, toward a section of the low-voltage side wiring LWB being away from the X-direction extending part XB, the Y-direction extending part YB has entered.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
RENESAS ELECTRONICS CORPORATIONTOKYO 135-0061

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
TSUNEMINE, Yoshikazu Ibaraki, JP 19 195

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