PACKAGE, MANUFACTURING METHOD OF PACKAGE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOVING OBJECT
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United States of America Patent
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Issued Date -
Apr 28, 2016
app pub date -
Oct 19, 2015
filing date -
Oct 24, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
A package includes a package base, a lid that is disposed to overlap the package base in a plan view when viewed in a thickness direction of the package base and has light permeability, and low melting point glass that is disposed between the package base and the lid, and bonds the package base and the lid, in which the low melting point glass has a region of which a width in a cross section along the thickness direction is widened toward a bonding surface of the lid.
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